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2227MC-28-03-05-F1

Manufacturer:

Multicomp

Mfr.Part #:

2227MC-28-03-05-F1

Datasheet:
Description:

IC and Component Sockets Through Hole DIP, Socket Number of Positions:28 Number of Rows:2 Pitch:2.54 mm Row Spacing:7.62 mm

ParameterValue
Width10.16 mm
RoHSCompliant
Insulation Resistance1 GΩ
REACH SVHCNo SVHC
Contact PlatingTin
Contact Material(Contact Finish)Bronze
Number of Contacts28
Connector TypeDIP, Socket
Row Spacing7.62 mm
Pitch2.54 mm
Min Operating Temperature-55 °C
Max Operating Temperature125 °C
Number of Rows2
PackagingBulk
Number of Positions28

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