

| Parameter | Value |
|---|---|
| Contact Plating | Tin |
| Lead Free | Lead Free |
| Power Rating | 1 W |
| Features | Moisture Resistant |
| Min Operating Temperature | -55 °C |
| Military Standard | Not |
| Composition(Kit Type) | Thick Film |
| Tolerance | 1 % |
| Height | 660.4 µm |
| Schedule B | 8533210045 |
| Termination | SMD/SMT |
| Temperature Coefficient | 1200 ppm/°C |
| Length | 6.35 mm |
| Max Power Dissipation | 1 W |
| Weight | 40.511469 mg |
| Number of Terminations | 2 |
| Resistance | 20 MΩ |
| Case Code (Imperial) | 2512 |
| Depth | 3.2 mm |
| Max Operating Temperature | 125 °C |
| Width | 3.2004 mm |
| Case Code (Metric) | 6432 |
| Case/Package | 2512 |
| Radiation Hardening | No |
| RoHS | Compliant |
| Packaging | Reel |
| Height - Seated (Max) | 0.65 mm |
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